Chip maker Qualcomm today introduced three new Gobi modem chipsets at Mobile World Congress in Barcelona, Spain and an improved version of the Snapdragon S4 chip for high-end smartphones. The 28-nanometer third-generation MDM8225, MDM9225 and MDM9625 support both LTE-Advanced and dual-carrier 84Mbps HSPA+ Release 10 cellular networks (perhaps fitting in T-Mobile USA’s 2012 plan). If that’s not speedy enough: The MDM9225 and MDM9625 can go all the way up to 150Mbps, because they support LTE Category 4 with carrier aggregation technology.
All three pieces of silicon are backwards compatible with today’s popular standards, including EV-DO Advanced, GSM, TD-SCDMA, FDD and TDD. The MDM8225 chipset supports UMTS-only devices, the MDM9225 chipset supports LTE and UMTS devices, and the MDM9625 chipset supports LTE, UMTS and CDMA2000 devices. All three chipsets will begin sampling in Q4 2012. Compared to Qualcomm’s previous MDM9x15 series (see below the fold), the new chips offer a reduction in power consumption and overall board area that allow for smaller devices with longer battery life.
Qualcomm also launched today an improved version of the Snapdragon S4 system-on-a-chip that powers about 340 mobile devices. It has notably faster graphics, supports Windows 8, includes dedicated hardware to accelerate Windows and fully supports the top game engines in the industry from Unity, Epic and others.
More on the new Snapdragon S4 “Pro” chip and full press releases are after the break.