ASUS has announced that it will be hosting a press event on May 30th at Humble House Taipei, where it is expected to reveal the next generation Zenfone, among other Zen-branded devices. Dubbed ‘Zenvolution’, the event will kick off at 2pm local time (6am GMT/1am Eastern/10pm Sunday 29th Pacific). Following the launch, ASUS will have a booth open at the Computex 2016 tradeshow between May 31st and June 4th at the Taipei World Trade Center Nangang Exhibition Hall.
Last year, ASUS surprised us a little with its ZenFone 2. It was the first phone to launch to mass market with 4GB RAM, it had admirable specifications and generous amounts of internal storage. All of this in a package which cost around half the amount of the flagships available at the time. It’s fair to say that expectations are high for this year’s version.
With that said, rumors and leaks have been few and far between for the Zenfone 3. According to listings found on Red Dot, the Zenfone 3 will be highly design-focussed and feature 2.5D glass with curved edges on the front and rear as well as a rounded aluminum frame. It’s expected to have fast-charging USB Type-C and a front camera flash, fingerprint sensor and new Smart Flip Cover. It’s also been rumored that ASUS is switching to Snapdragon processors, instead of the current Intel chips.
Apart from that, we don’t have much to go on so far. We’re expecting it to be running Android 6.0 Marshmallow with ASUS’ custom skin on top.
It will be interesting to see if ASUS continues with its strategy of releasing high-specced phones at competitive prices, or if it will be tempted to raise the retail price to improve its profit margins. With great devices like the Oppo F1 Plus, Xiaomi Mi 5, Huawei P9 and Honor 5X already on the market, and several more upcoming, it will have serious competition.