MediaTek has launched a new duo of Dimensity chipsets, with one of the new arrivals designed specifically for foldable phones.
Launched this week as spotted by GSMArena, the MediaTek Dimensity 7450 and Dimensity 7450X are basically refreshes to last year’s 7400 series which were announced in February 2025.
What’s new?
The core setup is the same – 4x Cortex-A78 cores at 2.6GHz, 4x Cortex-A55 cores at 2.0GHz, and a Mali-G615 MC2 GPU. Rather, connectivity is the main upgrade. A new 5G R17 modem promises better power efficiency and a boost to performance when moving.
MediaTek also says there’s a 7% boost to AI processing here.
As one of the most advanced chips in its class, the Dimensity 7450 supports the global 5G standard defined by 3GPP Release 17. This enables the latest 5G connectivity features for higher average speeds, broader coverage, and improved reliability, while maintaining excellent power efficiency…
The in-chip NPU enhances edge AI through additional hardware optimizations, increasing performance by up to 7%. AI Camera tasks deliver impressive performance and power efficiency upgrades over previous generation chipsets, enabling faster processing and enhanced energy savings.
As with the prior generation, the Dimensity 7400 is designed for standard phones, while the X variant is specifically designed with foldables in mind. The Dimensity 7450X is expected to debut in the 2026 update for the base Motorola Razr.
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