LG hasn’t had a problem with the Snapdragon 810 overheating in the G Flex 2
In early December, it was reported that Qualcomm was having some problems with its next-generation Snapdragon 810 chip. The SoC was said to be overheating at certain voltages, and this raised concerns that the next slew of flagships coming in early 2015 might see delays. LG then went on to announce its G Flex 2 smartphone at CES 2015, effectively squashing rumors about the 810 that had spread just about a month earlier.