In early December, it was reported that Qualcomm was having some problems with its next-generation Snapdragon 810 chip. The SoC was said to be overheating at certain voltages, and this raised concerns that the next slew of flagships coming in early 2015 might see delays. LG then went on to announce its G Flex 2 smartphone at CES 2015, effectively squashing rumors about the 810 that had spread just about a month earlier.
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Despite reports that some manufacturers are indeed having problems with the chip, LG says that it’s running just fine.
“I don’t understand why there is a issue over heat,” Woo Ram-chan, LG vice president for mobile product planning told Reuters. “I am very much aware of the various concerns in the market about the (Snapdragon) 810, but the chip’s performance is quite satisfactory.”
Samsung in particular doesn’t feel as giddy about the Snapdragon 810. According to a report on Wednesday from Bloomberg, the company found that the chip was having overheating issues, and has even gone as far as to resort to their own built-in-house Exynos chip for the upcoming Galaxy S6 flagship.
Meanwhile, LG’s G Flex 2 is ready to go on sale at the end of this month. According to LG, the Snapdragon 810 is actually helping the phone emit less heat than other phones on the market. Hopefully we won’t find out in the next several months that the company missed an obvious flaw.