G3-teardown

LG recently revealed its new top-shelf smartphone to the world and while the company talked up its latest handset’s bells and whistles, we’ve yet to see what really makes the G3 tick. Enter the folks at uBreakiFix, who’ve managed to get their hands on the device and tear it apart. Aside from completely revealing the phone’s hardware, this exploratory surgery helps determine the G3’s repairability.

If you were to pop the handset’s imaginary hood, here’s what you’d find:

  • Broadcom BCM4339 5G WiFi combo chip.
  • Avago ACPM-7700 power amplifier module.
  • Qualcomm WTR1625L RF transceiver.
  • Qualcomm WFR1620 receive-only companion chip.
  • SK Hynix 2GB/3GB LPDDR3 RAM layered on the 2.5 GHz quad-core Snapdragon 801 processor.
  • ANX7812 USB SlimPort Tx IC.
  • Texas Instruments BQ24296 battery charge management and system power path management chip.

The LG G3 managed to score an 8 out of 10 in terms of overall repairability, which according to the uBreakiFix’s findings makes it fairly easy to fix if you ever find yourself in a jam.

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