Specs for 4th-gen Moto X detailed along w/ ‘Amps’ modular backplates [Update]

Update: The reliable HelloMotoHK has posted a new picture (below) of the phone’s front panel that features ‘Moto’ above the fingerprint sensor.

Following yesterday’s leak of the upcoming Moto X, Venture Beat has gotten details of the device’s specs and a new modular ecosystem that will launch alongside the phone.

Lenovo will again be releasing two Moto X devices this year: the model in silver and white is codenamed the Vertex, while the one with a black face is the Vector Thin. The latter device will be a high-end model with a quad HD 5.5-inch AMOLED display, quad-core Snapdragon 820 chip with 3 or 4GB of RAM, and 32GB of storage. The Vector Thin has a 16MP sensor with laser-assisted and phase detection autofocus. At an incredibly thin 5.2mm, this device’s battery comes in at 2600mAh.

Meanwhile, the Vertex features an octa-core Snapdragon 625 and will come in a 2GB of RAM/16GB of storage and 3GB of RAM/32GB of storage configuration. This device will have a full HD display at the same size and 13MP camera with laser autofocus and optical image stabilization. The Vertex is still a thin device at 7mm and has a larger 3500mAh battery.

The thinness of both device will help accommodate modular backplates that snap on via magnets and connection pins on the back side. Venture Beat is reporting that Motorola has six “Amps” modules in the work for launch. The most basic module is a colored backplate, but Lenovo will also have a battery pack, camera grip with optical zoom and flash, rugged cover with wide angle lens, stereo speakers, and pico projector. Like the LG G5, third-party manufactures will be able to make their own modules.

Pricing on the actual device and modules is still unknown at this point, as is when they will launch. Lenovo is having an event on May 17th to likely launch the 4th-gen Moto G, while another event is scheduled for June 9th to launch a Project Tango device.