ChipWorks delves inside the Samsung Galaxy SIII

Élyse Betters | Jun 1 2012 - 2:13 pm PT

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ChipWorks and iFixit are hardcore when it comes to breaking open our favorite devices to see what is inside. The two websites decided to take it up a notch today by joining forces to publish a live teardown of the non-LTE Samsung Galaxy SIII. ChipWorks looked at the—you guessed—chips, while iFixit focused on repair aspects.

This is what the ChipWorks dissection unearthed:

Yep, that is Samsung’s Exynos 4412, 32 nm CMOS, 1.4 GHz quad core ARM processor.

“The Exynos is in a standard PoP (Package-on-Package) assembly with a Samsung LP DDR2 Green Memory K3PE7E700M-XGC2,” explained ChipWorks. “It is notable that this is the same process generation as we documented in the Apple A5 rev 2, APL2498, also fabricated by Samsung and for which you can see the general structure.”

The device also features the Sony IMX145 is an 8-megapixel, 1.4 um pixel pitch, back illuminated CMOS image sensor. Sony designs and manufactures this image sensor, which the Apple iPhone 4S also boasts. Samsung provides its own storage, however, with the KMVTU000LM. According to ChipWorks, it is a multi-chip Samsung MOVI N and memory module.

A few other chips worth mentioning:

-Wolfson WM1811AE Audio Codec
-Maxim Max77686 Power Management IC
-Maxim Max 77693 is a multifunctional device including PMIC, MUIC, flash LED control
-Audience 350B voice processor
-Silicon Image Inc 92240Bo RF Transmitter
-STMicroelectronics STD03 AMOLED Display Driver

Visit ChipWorks for more specs on the S III’s communications standards and touchscreen controller, or watch iFixit’s live teardown take place [here].

This article is cross-posted at 9to5Mac.

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